Bostik
Quickstrip Release Systems
Product Overview
Underlay pad to subfloor adhesive for use with the Quickstrip Underlay Release System. Allows underlay and carpet to be fully bonded, yet enables quick and easy removal of carpet and re-use of underlay and ultimately easy removal of underlay without damaging the subfloor.
- Minimizes disruption
- Reduces shut down time
- Reduces waste
- Reduces overall cost of flooring replacement
Composition
A pressure sensitive acrylic emulsion adhesive
Coverage
60 to 80m² per 15L
Size Available
15L, 36 per pallet
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