Bostik
Quickstrip Release Systems
Product Overview
Floor covering to underlay pad adhesive for use with the Quickstrip Underlay Release System. Allows underlay and carpet to be fully bonded, yet enables quick and easy removal of carpet and re-use of underlay and ultimately easy removal of underlay without damaging the subfloor.
- Minimizes disruption
- Reduces shut down time
- Reduces waste
- Reduces overall cost of flooring replacement
Composition
A solvent free acrylic adhesive
Coverage
45 m² per 15L
Size Available
15L
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